Grinding & Dicing Services, Inc.

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    About the Company

    We offer fast service without sacrificing the quality of wafer Dicing Services. Founded in Silicon Valley in 1992 by Noor Haq, an engineer and entrepreneur.

    Our Services

    Grinding and Dicing Services , Water Free Dicing Services, Stealth laser Dicing Process® Services, Wafer Dicing Services

    Our Snapshot

    • Company Size (FTE): 51-200